WebJun 20, 2011 · An immortal solder micro-bump (μbump) electromigration (EM) lifetime has been demonstrated for 3D IC integration. This ultimate goal was achieved under strictly … WebMay 1, 2011 · Electromigration Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond Proceedings - Electronic Components and Technology Conference DOI:...
(PDF) Comparison of the electromigration behaviors between micro-bumps ...
WebJun 6, 2008 · Electromigration is a phenomenon concerning the diffusion of metallic atoms induced by high density electron flow and Joule heating, and appears as voids and hillocks. Recently, with the rapid downsizing of electronic devices, the associated interconnecting metal lines and solder bumps are also being miniaturized. WebSep 14, 2011 · Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced void nucleation and growth in solder joints of Chip Scale Package (CSP) structure. clean vomit from foam mattress
FLIP CHIP BACK END DESIGN PARAMETERS TO REDUCE …
Web5.2 Electromigration Reliability of Solder Bumps . As described in Section 1.3.2 flip-chip solder bump technologies are essential components for 3D integration because they enable a conductive contact between vertically stacked wafers. The technology consists of three components: solder bump, metallic bond pad on the substrate side, and thin film under … WebHTOL testing was performed to determine the electromigration resistance of the bump alloys. In HTOL Test I, eutectic SnPb and enhanced eutectic SnPb1.0Cu bumps were tested. Al/NiV/Cu thin film UBM was used. Underfilled PST-2 test die on laminate boards with Ni/Au finish were used as the test vehicles. Webbumps, electromigration has now become a reliability concern. In this research, a commercially available finite element tool is adopted in order to study the distribution of current density in eutectic solder bump for variety of back end design parameters. Geometries needed were generated by using Pro/Engineer® Wildfire™ 3.0 as a cleanview mac